




Summary: The High-Speed Digital PCB Layout Engineer is responsible for the physical realization of complex, multi-layer printed circuit boards, ensuring signal integrity, timing, and power delivery. Highlights: 1. Ensuring digital signals reach their destination without distortion or noise 2. Designing the "backbone" of hardware to support high-density interconnects 3. Ensuring the Power Delivery Network (PDN) can handle high-current transients **Company Description** The Keenfinity Group delivers professional communication and security solutions that connect and protect people and assets. Following its carve\-out from the Bosch Group in mid\-2025, it operates as independent company within the portfolio of European investment firm Triton. The Group’s four Businesses include Audio delivering professional communication products of the globally renowned brands Bosch, Electro\-Voice, Dynacord, RTS and Telex, IQSIGHT Video Systems, Radionix Intrusion \& Access, and KEENFINITY Electronics Manufacturing Services (EMS). In fiscal year 2025, the group generated revenues of over €1 billion and employed approximately 4,000 people across more than 40 countries. **Job Description** The **High\-Speed Digital PCB Layout Engineer** is responsible for the physical realization of complex, multi\-layer printed circuit boards, used in advanced products such as video cameras, professional audio systems, embedded AI devices, advanced industrial systems, aerospace applications and MedTech electronics, where signal integrity, timing, and power delivery are the primary design constraints. **Responsibilities:** **Advanced Signal Integrity (SI) Management** You will be responsible for ensuring that digital signals reach their destination without distortion, reflections, or excessive noise. * **Impedance Control:** Calculate and implement controlled impedance for single\-ended and differential signals based on dielectric materials and stackup. * **Length \& Phase Matching:** Execute precise delay tuning and "snake" routing for high\-speed buses (DDR4/5, PCIe Gen 4/5, USB4\) to meet strict setup and hold time requirements. * **Topology Execution:** Implement complex routing topologies including Fly\-by, T\-topology, and Point\-to\-Point for multi\-drop memory interfaces. **Physical Design \& Stackup Architecture** Designing the "backbone" of the hardware to support high\-density interconnects (HDI). * **Stackup Definition:** Collaborate with fabrication houses to define layer counts, copper weights, and specialized materials (e.g., Megtron 6, Rogers) to minimize insertion loss. * **Constraint Management:** Set up and manage thousands of high\-speed design rules within the EDA constraint manager to automate error checking. * **Micro\-Via Strategy:** Utilize stacked and staggered micro\-vias, blind/buried vias, and via\-in\-pad technology for 0\.4mm and 0\.5mm pitch BGA components. **Power Integrity (PI) \& Thermal Design** Ensuring the Power Delivery Network (PDN) can handle high\-current transients without excessive voltage drop. * **Plane Design:** Design solid, low\-inductance power and ground planes to provide stable voltage to CPUs, FPGAs, and ASICs. * **Decoupling Optimization:** Optimize the placement of decoupling capacitors to minimize the loop inductance of the PDN. * **Thermal Relief:** Work with mechanical engineers to place high\-power components and thermal vias to prevent localized "hot spots" on the board. **Qualifications** **Qualifications** * MSc or PhD in Electrical Engineering, Electronics Engineering. * 5\+ years of experience in electronic hardware design, with a strong focus on high\-speed digital circuits. * Experience in circuit simulation tools is highly valued. * Strong understanding of signal integrity and power integrity concepts. * Experience with high\-speed interface design and testing. * Familiarity with industry standards and regulatory compliance (e.g., EMC). * Excellent problem\-solving and analytical skills. * Strong communication and teamwork skills. **What distinguishes you:** * Strong experience and Knowledge with PCB layout design tools such as Xpedition, Altium, or equivalent tools. * Good experience with circuit design simulator software packages such as HyperLinx, PSPICE, LTSpice, or equivalent simulation tools. * Experience in MedTech and/or aerospace industries is highly valued. * Languages: fluent in English, other languages are a plus. * Stay up\-to\-date with the latest technologies and industry trends. **Additional Information** **Keenfinity benefits includes:** * ️ Flexible work conditions Hybrid work system * ️ Medical office on site (nutrition, psychology, physiotherapy and general clinic) ️ Canteen ️ Free parking lot ️ Sports and health related activities (gym) Training opportunities (i.e., technical training, foreign languages training) \& certifications Opportunities for career progression and continuous professional development Exchange with colleagues around the world Access to great discounts in partnerships and products All our positions are open to people with disability **\-** *At Keenfinity we don’t just build innovative solutions — we shape a smarter, more connected world through technology.* *We value different backgrounds, ideas, and experiences and we’re committed to growing, learning, and celebrating success as one team. Everyone is welcome here — we foster an environment where everyone is respected, valued, and encouraged to be their authentic self.* *Keenfinity is an equal opportunity employer, offering equal opportunities for all. We welcome applications from people with disabilities and can offer support, if needed. When everyone has a chance to contribute, we all do better.*


